*Team：2 professional engineers and purchasers
*Partner：30+ suppliers（Shengyi electronics，SCC，Founder，Kinwong，Fastprint…）
*Partnership： Strategic cooperation
Quick-turn and flexible delivery
Support of wide range of PCBs : High -layer ,multi-layer , rigid flex , high frequicy and high speed ,etc .
Professional supplier positioning
Whole-flow quality assurance ,IPC,Special industry inspection standard
PCB Capabilities ：
| Items | Current Capabilities |
|---|---|
| Highest Layers | 68 layers |
| Min. Line Width/Space | 2.5mil / 2.5mil |
| Max. Copper Thickness | 10 OZ |
| Min. Hole Diameter | Mechanical Drilling: 4mil Laser Drilling 2mil |
| Max. Aspect Ratio | 22:1 |
| Impedance Tolerance | +/- 3% |
| Outline Tolerance | +/- 0.1mm |
| Materials | FR-4, High Tg, Halogen free, Ceramic filling, HF/Microwave (Rogers, Taconic, Arlon, F4B), metal base/core (Aluminum, Copper, Metal) |
| Surface Treatment | HASL, OSP, plate gold, ENIG, immersion silver/Tin, Gold finger, Hard gold, nickel gold, elective gold plating etc. |
| Special | Rigid-flex, buried core buried optical fiber, 3+n+3 overlapped hole HDI, Via in pad, High TG thick copper, hybrid, partial hybrid, multi-surface finish, metal substrate/core board, blind hole, impedance control etc. |
